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	Aug 28, 2008

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Epoxy Resin offers dimensional stability.

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News Story

Epoxy Resin offers dimensional stability.

April 8, 2008 - Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic solvents over temperature range of -65 to +250°F.

Related categories: Adhesives and Sealants | Paints and Coatings

Press Release
Release date: March 30, 2008

Epoxy Has Outstanding Dimensional Stability

Master Bond Inc., Hackensack, N.J. has developed EP21LM-3, a two component, medium viscosity epoxy resin system for high performance bonding, encapsulation and coating. EP21LM-3 readily develops high physical strength properties including a tensile modulus greater than 100,000 psi (690 MPa) and a tensile shear strength greater than 2300 psi (16 MPa). It is easy to apply. Having a viscosity of 37,000 cps the product flows evenly and smoothly without application of pressure, wets surfaces and fills volumes quickly and completely.

The cured polymer has a Shore D hardness of 64. It features remarkable resistance to thermal cycling and many chemicals including water, oil, fuels and most organic solvents over the temperature range of -65°F to +250°F. Adhesion to metals, glass ceramics, wood, vulcanized rubbers and many plastics is excellent. The EP21LM-3 system is a superior electrical insulator with a dielectric strength over 350 V/mil and a volume resistivity of 1014 ohm-cm. Master Bond EP21LM-3 system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is available pint, quart, gallon and 5 gallon containers.

For further information, please contact:
James Brenner
main@Masterbond.com

Visit our WEBSITE at http:/www.masterbond.com Or E-Mail us at Main@Masterbond.com

Contacts:

General Information:
James Brenner
USA

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Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com

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More New Product News from this company:
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Jun 19, 2008	Instant-Cure Cyanoacrylate Adhesive forms strong bonds.
Jun 6, 2008	UV Adhesive is USP Class VI approved for medical devices.
May 30, 2008	UV Curable Adhesive targets medical device manufacturing.
May 6, 2008	Epoxy Resin System passes NASA's low outgassing test.
May 6, 2008	Epoxy Adhesive is suited for cryogenic applications.
Mar 31, 2008	Epoxy Resin resists temperatures up to 500°F.
Mar 19, 2008	Polymer System cures by UV light and/or heat.
Feb 28, 2008	Silicone Potting Compound assures complete fill-in.
Feb 7, 2008	Potting Compound has flexible, low-viscosity formulation.
Feb 6, 2008	Conductive Adhesive withstands severe conditions.
Feb 5, 2008	Two-Component Epoxy Adhesive gels in 3 minutes.
Jan 11, 2008	Polymer System suits high temperature bonding applications.
Nov 30, 2007	Epoxy suits coating, sealing, and encapsulation applications.
Nov 8, 2007	Adhesive is heat, thermal cycling, and chemicals resistant.
Oct 30, 2007	Silver Conductive Epoxy Adhesive exhibits high flexibility.

Other News from this company:
Aug 19, 2008	New Cost Effective, High Conductivity Epoxy
Dec 26, 2007	Cost Effective Anti-Static Electrically Conductive Latex Coating
Dec 25, 2006	Thermally Conductive Epoxy is Exceptionally Flexible

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